RadiSys to Present at the RBC Capital Markets 2009 Technology, Media and Communications Conference on June 9, 2009

HILLSBORO, Ore.--(BUSINESS WIRE)--RadiSys^® Corporation (NASDAQ: RSYS), a leading global provider of advanced embedded solutions, announced that it will participate in the RBC Capital Markets’ 2009 Technology, Media and Communications Conference to be held June 9-10, 2009 in San Francisco, CA. Brian Bronson, RadiSys Chief Financial Officer, will present an overview of the Company’s business and strategy on Tuesday, June 9, 2009 at 9 a.m. PT.

A live audio webcast and a replay of the event will be available on the Company’s investor relations website at http://investor.radisys.com/.

About RadiSys

RadiSys (NASDAQ: RSYS) is a leading provider of advanced embedded solutions for the communications networking and commercial systems markets. Through intimate customer collaboration and combining innovative technologies and industry-leading architecture, RadiSys helps OEMs, systems integrators and solution providers bring better products to market faster and more economically. RadiSys products include embedded boards, application enabling platforms and turn-key systems, which are used in today’s complex computing, processing and network intensive applications. For more information, visit http://www.radisys.com, write to info@radisys.com, or call 800-950-0044 or 503-615-1100. Editors seeking more information may contact Lyn Pangares at RadiSys Corporation at 503-615-1220 or lyn.pangares@radisys.com.

RadiSys® is a registered trademark of RadiSys Corporation.

RadiSys Corporation
Chief Financial Officer
Brian Bronson, 1-503-615-1281
brian.bronson@radisys.com
or
Finance and Investor Relations Manager
Holly Stephens, 1-503-615-1321
holly.stephens@radisys.com