Alchimer: NEXX Systems licenses Alchimer's eG ViaCoat Technology for Metallization of High Aspect Ratio TSVs

STUTTGART, Germany--(BUSINESS WIRE)--Alchimer S.A., the nanometric TSV metallization company, has licensed its eG ViaCoat^TM product for creating thin, conformal copper seed layers for TSV metallization to NEXX Systems, Inc., a leader in electro-deposition systems for through-silicon vias (TSV) applications.

Under the terms of the agreement, Alchimer will supply NEXX with process recipes for eG ViaCoat and the use of chemistries to optimize wet Cu TSV metallization. Alchimer's scientists and engineers will also provide continuous support to NEXX by characterizing and customizing the process for a wide variety of barrier layer materials. The agreement is the first of its kind, in that it provides the industry with a 300mm production platform for wet TSV seed deposition in line with Cu fill.

eG ViaCoat is Alchimer's electrochemical coating process for the metallization of high aspect ratio TSVs used in advanced 3D packaging applications. eG ViaCoat produces conformal, thin, uniform and adherent copper seed layers, even on resistive barriers. It enables significant reduction in cost of ownership (CoO) for TSVs as compared to dry vacuum processes. eG ViaCoat won the Best of the West Award at Semicon West 2008.

NEXX Systems is an industry leader in electro-deposition and PVD solutions for advanced packaging and 3D applications. NEXX Stratus ECD systems won Best Product awards in 2008 from Semiconductor International and Advanced Packaging, and NEXX’s Apollo PVD system won the Attendees' Choice Award 2008 for best CoO product from Solid State Technology/Advanced Packaging.

"We are very excited to be working with NEXX, a leader in ECD tool performance and productivity for TSVs. The Stratus tool is the perfect 300mm platform from which to demonstrate the economic value proposition of our eG ViaCoat product," comments Steve Lerner, CEO of Alchimer.

“The unparalleled performance of ViaCoat enables us to further increase the productivity of our Stratus plating platform at lower cost. ViaCoat provides a less complex solution for copper seed than competitive solutions that require additional tool sets with attendant high costs," says Dick Post, Chairman of NEXX Systems. "We are pleased to enter into such an agreement with Alchimer at a time when cost reduction is so critical to making 3D packaging meet the required cost targets.”

For further information about Alchimer please visit: www.alchimer.com

For further information about NEXX Systems please visit: http://www.nexxsystems.com

Alchimer S.A.
Emmanuel Guidotti
Tel: +33 1 69 75 43 43
E-mail: emmanuel.guidotti@alchimer.com
Fax: +33 1 60 11 07 52
Web: www.alchimer.com
or
Publitek Limited
Sally Ward-Foxton
Tel: +44 (0)1225 470000
E-mail: sally.ward-foxton@publitek.com
Fax: +44 (0)1225 470047
Web: www.publitek.com