DUBLIN, Ireland--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/041061/nokia_wcdma_2100mh) has announced the addition of EJL Wireless Research's new report "Nokia WCDMA 2100MHz Power Amplifier Tear Down Report" to their offering.

This report covers the design analysis of an Nokia W-CDMA 2100MHz power amplifier unit. This unit is an integral part of an Nokia W-CDMA base transmitting station (BTS). The unit was manufactured in mid 2002.

A complete bill of materials of all active semiconductors and passive components is presented with the following information:

• Complete Part Number/Marking
• Component Manufacturer Identification
• Functional Component Description

• Package Type

Benefits of the Report:

• Proprietary Data

• Comprehensive Bill of Materials Analysis

• Mechanical Design Analysis

Features of the Report:

• Total Pages: 67
• Total Tables: 27
• Total Exhibits: 65

• Full Color Pictures of PCB and Modules

• Mechanical Drawings and Dimensions

• Complete Part Number Identification

• Complete Component PCB Placement Identification

Targeted Users:

• Mobile Operators
• Base Station Equipment OEMs
• RF Subsystems Manufacturers

• Semiconductor Manufacturers

Key Topics Covered:
POWER AMPLIFIER TECHNOLOGY
-- Overview of Nokia UltraSite 3G BTS
W-CDMA POWER AMPLIFIER PRODUCT
-- Mechanical Analysis
--System Architecture Analysis
-- DC/DC Power Supply Section
-- RF Cavity Filter Section
-- Digital Baseband Section
-- High Power RF Section
List of Tables
- Digital/RF Cable Bill of Materials
- Power Supply Bill of Materials
- M2 Module Bill of Materials
- DC-DC Converter Module PCB Bill of Materials
- DC-DC Converter Module Daughter Card 1 Bill of Materials
- DC-DC Converter Module Daughter Card 2 Bill of Materials
- Power Supply Connector PCB Bill of Material
- RF Cavity Filter Bill of Materials
- Digital Baseband Section Bill of Materials Area 1
- Digital Baseband Section Bill of Materials Area 2
- Digital Baseband Section Bill of Materials Area 3
- Digital Baseband Section Bill of Materials Area 4
- Digital Baseband Section Bill of Materials Area 5
- Digital Baseband Section Bill of Materials Area 6
- Digital Baseband Section Bill of Materials Area 7
- Digital Baseband Section Bill of Materials Area 8
- Digital Baseband Section Bill of Materials Area 9
- Digital Baseband Section Bill of Materials Area 10
- Digital Baseband Section Bill of Materials Area 11
- Digital Processor Module Bill of Materials
- Area A Small Signal Pre Driver Amplifier Section Bill of Materials
- Area B RF Driver Pallet Bill of Materials
- Area C High Power RF Output Pallet Bill of Materials
- Area C High Power RF Input/Output PCB Bill of Materials
- Area D High Power RF Error Amplifier Small Signal Bill of Materials
- Area E High Power RF Error Amplifier Driver/Output Pallet Bill of
 Materials
- Active/Passive Component Distribution by System Subsection
List of Exhibits:
- Nokia UltraSite BTS
- Power Amplifier System Case Dimensions
- RF Cables 1
- RF Cables Component Diagram
- RF Cables 2
- RF Cables Component Diagram 1
- Digital Cables Component Diagram
- Digital Cables Component Diagram
- Power Amplifier Sub-System Diagram
- Power Amplifier RF Sub-System Diagram
- Power Supply Location
- Basic Feed Forward Amplifier Block Diagram
- Power Supply Location
- Power Supply Component Diagram
- M2 Module PCB Top View
- M2 Module PCB Bottom View
- DC-DC Converter Module, Top View
- DC-DC Converter Module Component Diagram
- DC-DC Converter Module Daughter Card 1
- DC-DC Converter Module Daughter Card 2
- Power Supply Connector PCB, Top View
- Power Supply Connector PCB, Bottom View
- RF Cavity Filter, Top
- RF Cavity Filter, Bottom
- RF Cavity Filter Transmit Diagram
- RF Cavity Filter, Bottom without Waveguide Shielding
- RF Cavity Filter, Top Component Diagram
- RF Cavity Filter, Bottom Component Diagram
- RF Cavity Filter, Bottom with Stripline PCBs Removed
- Digital Baseband Section PCB Top View
- Digital Baseband PCB Bottom View
- Digital Baseband Section Area 1
- Digital Baseband Section Area 2
- Digital Baseband Section Area 3
- Digital Baseband Section Area 4
- Digital Baseband Section Area 5
- Digital Baseband Section Area 6
- Digital Baseband Section Area 7
- Digital Baseband Section Area 8
- Digital Baseband Section Area 9
- Digital Baseband Section Area 10
- Digital Baseband Section Area 10 Top
- Digital Baseband Section Area 10 Middle
- Digital Baseband Section Area 10 Bottom
- Digital Baseband PCB Dimensions
- Digital Baseband Shield Bottom, Bottom View
- Digital Baseband Shield Bottom, Top View
- Digital Baseband Shield Top, Top View
- Digital Baseband Shield Top, Bottom View
- Digital Processor Module PCB, Top View
- Digital Processor Module PCB, Bottom View
- RF Shielding for Power Amplifier
- High Power RF Section Diagram
- High Power Pallet Shield Cover, Top and Bottom Views
- RF Main Amplifier Transmit Diagram
- Small Signal Pre Driver Amplifier Section Component Diagram
- RF Driver Pallet Component Diagram
- High Power RF Output Pallet Component Diagram
- High Power RF Error Amplifier Small Signal Section Component Diagram
- High Power RF Error Amplifier Transmit Diagram
- High Power RF Error Amplifier Driver/Output Pallet Component Diagram
- Component Distribution Analysis
- Passive Component Distribution Analysis
- Active Component Analysis by Pin Count
- Active Semiconductor Component Market Share
Companies Mentioned:
- AcBel Polytech
- Ace Technology
- Analog Devices
- Anaren Microwave
- Bourns
- Fairchild Semiconductor
- Freescale Semiconductor
- International Rectifier
- Kemet
- Linear Technology
- Maxim Integrated Circuits
- Murata Electronics Co., Ltd.
- ON Semiconductor
- RF Microdevices
- Skyworks Solutions
- STMicroelectronics
- Texas Instruments
- Xilinx

For more information visit http://www.researchandmarkets.com/research/041061/nokia_wcdma_2100mh

Research and Markets
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